AMKR - Amkor Technology, Inc.
About Amkor Technology, Inc. (https://amkor.com)
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Key Executives
| NAME | TITLE | DOB | SALARY |
|---|---|---|---|
| Megan Faust | Executive Vice President, Chief Financial Officer & Treasurer | 1974 | $1,245,488 USD |
| Farshad Haghighi | Executive Vice President & Chief Sales Officer | 1963 | $1,128,128 USD |
| Kevin Engel | President, Chief Executive Officer & Director | 1973 | $1,115,166 USD |
| Mark N. Rogers | Executive Vice President, General Counsel & Corporate Secretary | 1966 | $1,113,002 USD |
| JinAn Lee | Executive Vice President of Worldwide Manufacturing | – | $560,509 USD |
| Susan Y. Kim | Chairman | 1963 | $235,001 USD |
| John Don Liu | Executive Vice President, Corporate Development & Strategy | 1968 | $98,504 USD |
| Cherie Buntyn | Senior VP & Chief Accounting Officer | 1977 | – |
| Jennifer Jue | Vice President of Investor Relations & Finance | – | – |