Applied Materials, Inc. logo AMAT - Applied Materials, Inc.

Price: -- -- | CONSENSUS: Buy DETAILS
STRONG
BUY
1
BUY 42
HOLD 12
SELL 0
STRONG
SELL
0
| PRICE TARGET: $662.87 DETAILS
HIGH: $900.00
LOW: $530.00
MEDIAN: $645.00
CONSENSUS: $662.87
UPSIDE: 27.32%

Stock News

Applied Materials vs. Nvidia: What Revenue Trends Reveal About These Artificial Intelligence Companies

Applied Materials vs. Nvidia: What Revenue Trends Reveal About These Artificial Intelligence Companies

Nvidia currently generates a higher total revenue volume than Applied Materials, holding a clear numerical lead during all eight of the quarters included in this comparison. Applied Materials maintained mostly stable quarter-over-quarter revenue over the first six periods before recording a recent uptick, while Nvidia demonstrated continuous quarter-over-quarter growth throughout the entire timeframe.

Oct 06, 2026 03:46 PM • fool.com
Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems  Collaboration builds on the companies' long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

Oct 06, 2026 05:00 AM • globenewswire.com
Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling

Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling

Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in Singapore Expanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-out Partnership expands beyond die-to-wafer hybrid bonding to new hybrid bonding platforms, scaling of thermo-compression bonding (TCB), and new die-on-wafer, die-on-die and die-on-panel architectures SANTA CLARA, Calif. and DUIVEN, The Netherlands, Oct. 01, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT) and BE Semiconductor Industries N.V.

Oct 01, 2026 05:00 AM • globenewswire.com

Price Targets